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Semiconductor Burn In Test Pcb Board Fabrication Process 0.3 Pitch 8 Layer

Topmatch Electronics (Suzhou) Co., Limited.
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    Buy cheap Semiconductor Burn In Test Pcb Board Fabrication Process 0.3 Pitch 8 Layer from wholesalers
     
    Buy cheap Semiconductor Burn In Test Pcb Board Fabrication Process 0.3 Pitch 8 Layer from wholesalers
    • Buy cheap Semiconductor Burn In Test Pcb Board Fabrication Process 0.3 Pitch 8 Layer from wholesalers
    • Buy cheap Semiconductor Burn In Test Pcb Board Fabrication Process 0.3 Pitch 8 Layer from wholesalers
    • Buy cheap Semiconductor Burn In Test Pcb Board Fabrication Process 0.3 Pitch 8 Layer from wholesalers
    • Buy cheap Semiconductor Burn In Test Pcb Board Fabrication Process 0.3 Pitch 8 Layer from wholesalers

    Semiconductor Burn In Test Pcb Board Fabrication Process 0.3 Pitch 8 Layer

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    Brand Name : TOPCBS
    Model Number : BIB and test Boards
    Certification : UL94V0
    Price : Negotiation
    Payment Terms : T/T
    Supply Ability : 10000unit per month
    Delivery Time : 10-14working days
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    Semiconductor Burn In Test Pcb Board Fabrication Process 0.3 Pitch 8 Layer

    0.3pitch 8Layer HDI PCBs for Burn in boards and semiconductor Test boards / thin board


    A burn-in board is a printed circuit board that is used in the burn-in process.

    The components added to the board are stressed using extreme heat to highlight any failures. Once the stress tests have been completed engineers will analyse the results to make sure everything is working within the correct parameters.


    During the burn-in process extreme temperatures often ranging from 125°C – 250°C or even 300°C are applied so the materials used need to be extremely durable. Generally speaking we use IS410 for applications up to 155°C and polyimide for applications up to 250°C. For temperatures over 250°C a higher grade of polyimide is used. We also use high temperature lead free solders and stainless-steel board fixtures.

    1 . Descriptions:


    What is a BIB ?


    A burn-in board is a printed circuit board that is used in the burn-in process. The components added to the board are stressed using extreme heat to highlight any failures. Once the stress tests have been completed engineers will analyse the results to make sure everything is working within the correct parameters.


    2 . Specifications:


    Name0.3pitch 8Layer HDI PCBs for Burn in boards and semiconductor Test boards
    Number of Layers8
    Quality GradeIPC 6012 Class 2,IPC 6012 Class 3
    MaterialIT180
    Thickness0.8mm
    Min Track/Spacing75um/75um
    Min Hole SizeLaser 75um
    Solder MaskGreen
    SilkscreenWhite
    Surface FinishImmersion gold + OSP
    Finished Copper12um
    Production time10-21 working days
    Lead time2-3 days

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