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Do best to meet your technical in PCBs
5 Years
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| Brand Name : | TOPCBS |
| Model Number : | Electronic cigarette mainboard |
| Certification : | UL94V0 |
| Price : | Negotiation |
| Payment Terms : | T/T |
| Supply Ability : | 10000unit per month |
| Delivery Time : | 10-14working days |
4Layer Rigid-flex PCB for Electronic cigarette mainboard
| layer | 1-20 layer |
| Material type | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
| Board thickness | 0.21mm to 7.0mm |
| Copper thickness | 0.5 OZ to 6 oz |
| Size | Max. Board Size: 580mm×1100mm |
| Min. Drilled Hole Size: 0.2 mm (8 mil) | |
| Min. Line Width: 4mil (0.1mm) | |
| Min. Line Spacing: 4mil (0.1mm) | |
| Surface finishing | HASL / HASL lead free, HAL, Chemical tin, Immersion Silver/Gold, OSP, Gold plating |
| Solder Mask Color | Green/Yellow/Black/White/Red/Blue |
| Tolerance | Shape tolerance: ±0.13 |
| Hole tolerance: PTH: ±0.076 NPTH: ±0.05 | |
| Certificate | UL, ISO 9001, ISO 14001 |
| Special requirements | Buried and blind vias+controlled impedance +BGA |
| Profiling | Punching, Routing, V-CUT, Beveling |
Rigid-flex PCB can be used in consumer electronics, and meet 3D assembly requirement of products with specific flexible bending area design, .
Specifications:
| Name | 4Layer Rigid-flex PCB for Electronic cigarette mainboard |
| Layers | 4 |
| Quality Grade | IPC 6012 Class 2,IPC 6012 Class 3 |
| Material | DS-600D |
| Min Track/Spacing | 75um/100um |
| Drilling Size | 100um |
| Solder Mask | Green |
| Silkscreen | White |
| Surface Finish | Immersion gold |
| Finished Copper | 1/3OZ |
| Production time | 10-21 working days |
| Lead time | 2-3 days |
| Capability | Standard | Advanced | Capability | Standard | Advanced | Capability | Standard | Advanced |
| Line width space | 2.36/2.36mil | 2.0/2.0mil | Nath Aperture size | ±2mil | ±1.5mil | Min. SMT/QFP Pitch | 10mil | NA |
| Max Copper foil thickness | 2oz | 4oz | Hole location Accuracy | ±3mil | ±2mil | Min. BGA Pitch | 12mil | NA |
| Min. via hole size | Min:0.2mm | Min:0.15mm | Distance from the center of the hole to the center of the hole | ±4mil | ±3mil | Max. Test Points/Board(Universal ET) | Bed of Nail Test:16000 | NA |
| Min. blind hole size | Min:0.1mm | Min:0.05mm | Hole to Edge Precision | ±3mil | ±2mil | Flying Probe Test:1-∞ | ||
| Minimum semi-metalized hole | Min:0.45mm | Min:0.40mm | Layer to layer registration | ±4mil | ±3mil | v-cut Depthing | ±4mil | ±3mil |
| Buried hole | 4-16 layer | 24 layer | Shape Size tolerance | ±4mil | ±3mil | v-cut Angel | 20°,30°,45° | NA |
| Max production board size | 520mmX620mm | 540mmX640mm | Impedance tolerances | ±10% | ±8% | v-cut precision | ±4mil | ±3mil |
| Max Aspect ratio | 8:01 | 10:01 | Min. Solder Mask Dam Width | Green Oil:3mil | Green Oil:2.5mil | |||
| line width space | ±20% | ±10% | Other:4.5mil | Other:4mil | ||||
| Pth Aperture size | ±3mil | ±2mil | S/M Registration | ±1.5mil | ±1.2mil |
| Surface Finishes |
| Electroless Nickel Immersion Gold (ENIG) |
| Hot Air Solder Level (HASL, Lead and Lead‐free) |
| OSP, Immersion Tin,Immersion Silver, ENEPIG |
| Gold Fingers, Flash Gold, Full Body Hard Gold, Wire Bondable Gold |
| Selective and Multiple Surface Finishes, Carbon Ink, Peelable SM |
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