PCBA Service PCB Assembly 94v0 FR4 High TG Multilayer HDI PCB Board

The design of a printed circuit board for 5G applications is entirely focused on the management of mixed high speed and high frequency signals. In addition to the standard rules relating to the design of PCBs with high frequency signals, it is necessary to select the material appropriately in order to prevent power losses and guarantee the integrity of the signal. In addition, EMI that may arise between the parts of the board that manage analog signals and those that handle digital signals must be prevented, thus meeting the FCC EMC requirements. The two parameters that guide the choice of the material are thermal conductivity and thermal coefficient of dielectric constant, which describes changes in the dielectric constant (typically in ppm/°C). A substrate with high thermal conductivity is obviously preferable, since it is able to easily dissipate the heat produced by the components. The thermal coefficient of dielectric constant is an equally important parameter, as variations in the dielectric constant can induce dispersions, which in turn can stretch digital pulses, change the signal propagation speed and in some cases also produce signal reflections along a transmission line.

1. Product application

Any layer of interconnect board products can be applied to mobile communication terminals, which integrates a variety of circuits, enabling mobile terminals to handle complex tasks and have rich communication methods. With the development of communication technologies, mobile terminals have become modern Internet services. The main platform.

2 . Specifications:

PCBs for high frequency applications require to be subjected to automatic inspection procedures, both optical (AOI) or performed through ATE. These procedures allow to enormously increase the quality of the product, highlighting possible errors or inefficiencies of the circuit. The recent progress made in the field of automatic inspection and testing of PCBs has led to significant time savings and reduced costs associated with manual verification and testing. The use of new automated inspection techniques will help overcome the challenges imposed by 5G, including global impedance control in high frequency systems. Increased adoption of automated inspection methods also allows for consistent performance with high production rates.

Our PCBs facility is located at East China, closed to Shanghai City.

We delivery our technology in High Layer Count、Rigidflex 、HDI  and other special boards with competitive cost.