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Any Layer Hdi Pcb Board Custom Em 370 Pcb Material CCL UFS OSC OSP 0.95mm

Topmatch Electronics (Suzhou) Co., Limited.
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    Buy cheap Any Layer Hdi Pcb Board Custom Em 370 Pcb Material CCL UFS OSC OSP 0.95mm from wholesalers
     
    Buy cheap Any Layer Hdi Pcb Board Custom Em 370 Pcb Material CCL UFS OSC OSP 0.95mm from wholesalers
    • Buy cheap Any Layer Hdi Pcb Board Custom Em 370 Pcb Material CCL UFS OSC OSP 0.95mm from wholesalers
    • Buy cheap Any Layer Hdi Pcb Board Custom Em 370 Pcb Material CCL UFS OSC OSP 0.95mm from wholesalers
    • Buy cheap Any Layer Hdi Pcb Board Custom Em 370 Pcb Material CCL UFS OSC OSP 0.95mm from wholesalers
    • Buy cheap Any Layer Hdi Pcb Board Custom Em 370 Pcb Material CCL UFS OSC OSP 0.95mm from wholesalers

    Any Layer Hdi Pcb Board Custom Em 370 Pcb Material CCL UFS OSC OSP 0.95mm

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    Brand Name : TOPCBS
    Model Number : 0.95mm Anylayer HDI / 12L mainboard
    Certification : UL94V0
    Price : Negotiation
    Payment Terms : T/T
    Supply Ability : 10000unit per month
    Delivery Time : 10-14working days
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    Any Layer Hdi Pcb Board Custom Em 370 Pcb Material CCL UFS OSC OSP 0.95mm

    0.95mm Anylayer HDI / 12Layer mainboard / EM370D CCL / UFS and OSC area OSP treatment

    Definitions and standards for HDI

    • IPC-DD-135 Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules (8/95)
    • IPC-2226 Sectional Design Standard for High Density Interconnect (HDI) Boards (04/03)
    • IPC/JPCA-2315 Design Guide for High Density Interconnects (HDI) and Microvia (06/00)
    • IPC-6016 Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards (05/99)
    • IPC-4104 Specification for High Density Interconnect (HDI) and Microvia Materials (5/99)


    1 . Descriptions:


    What is a HDI PCB?


    HDI stands for High Density Interconnector. A circuit board which has a higher wiring density per unit area as opposed to conventional board is called as HDI PCB. HDI PCBs have finer spaces and lines, minor vias and capture pads and higher connection pad density. It is helpful in enhancing electrical performance and reduction in weight and size of the equipment. HDI PCB is the better option for high-layer count and costly laminated boards.


    Regarding the electrical needs of high-speed signal, the board should have various features i.e. high-frequency transmission capability, impedance control, decreases redundant radiation, etc. The board should be enhanced in the density because of the miniaturization and arrays of the electronic parts. In addition, to the result of the assembling techniques of leadless, fine pitch package and direct chip bonding, the board is even featured with exceptional high-density.


    Innumerable benefits are associated with HDI PCB, like high speed, small size and high frequency. It is the primary part of portable computers, personal computers, and mobile phones. Currently, HDI PCB is extensively used in other end user products i.e. as MP3 players and game consoles, etc.


    2 . Specifications:


    Name0.95mm Anylayer HDI / 12L mainboard
    Number of Layers12
    Quality GradeIPC 6012 Class 2,IPC 6012 Class 3
    MaterialEM370(D)
    Thickness0.95mm
    Min Track/Spacing50um/60um
    Min Hole SizeLaser 75um; Drilling size 200um
    Solder MaskBlue
    SilkscreenWhite
    Surface FinishImmersion gold,OSP
    Finished Copper12um
    Production time10-21 working days
    Lead time2-3 days

    3. Advantages:


    The most common reason for using HDI technology is a significant increase in packaging density. The space obtained by finer track structures is available for components. Besides, overall space requirements are reduced will result in smaller board sizes and fewer layers.

    Usually FPGA or BGA are available with 1mm or less spacing. HDI technology makes routing and connection easy, especially when routing between pins.



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