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High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer

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Topmatch Electronics (Suzhou) Co., Limited.

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High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer

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Brand Name :	TOPCBS
Model Number :	BIB and test Boards
Certification :	UL94V0
Price :	Negotiation
Payment Terms :	T/T
Supply Ability :	10000unit per month
Delivery Time :	10-14working days

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High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer

0.25 pitch 12Layer HDI PCBs for Burn in boards and semiconductor Test boards / thin board

Reduced product development time
Increased customer confidence
100% product quality and reliability
A forecast life expectancy
Reduced circuit board manufacturing costs
Increased profitability
Reduced after sales service

1 . Descriptions:

What is a BIB ?

A burn-in board is a printed circuit board that is used in the burn-in process. The components added to the board are stressed using extreme heat to highlight any failures. Once the stress tests have been completed engineers will analyse the results to make sure everything is working within the correct parameters.

2 . Specifications:

Name	0.25pitch 12Layer HDI PCBs for Burn in boards and semiconductor Test boards
Number of Layers	12
Quality Grade	IPC 6012 Class 2,IPC 6012 Class 3
Material	IT180
Thickness	0.7mm
Min Track/Spacing	75um/75um
Min Hole Size	Laser 75um
Solder Mask	Green
Silkscreen	White
Surface Finish	Immersion gold + OSP
Finished Copper	12um
Production time	10-21 working days
Lead time	2-3 days

Product Tags:

pcb burn in test 0.25 pitch

hdi pcb burn-in test procedure 0.25 pitch

hdi pcb burn-in test procedure 12Layer

High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer

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