High Density HDI PCB Circuit Board Medical PCB & PCBA Motherboard PCB Assembly With Components​

HDI board is generally made by stacking, the more times the stacking, the higher the technical level of the board.

Ordinary HDI board is basically one stacking. The high level HDI uses two or more laminar structure of technology. At the same time, the use of stacking holes, electroplating hole filling, laser direct drilling and other advanced PCB technology. When PCB density increases beyond eight layers, the cost of manufacturing with HDI is lower than that of traditional complex laminating processes.

The electrical performance and signal accuracy of HDI board are higher than traditional PCB. In addition, HDI board for radio frequency interference, electromagnetic interference, electrostatic release, heat conduction and other better improvement. High density integration (HDI) technology enables end product designs to be miniaturized while meeting higher standards of electronic performance and efficiency.

1 . Descriptions:

What is a HDI PCB?

HDI stands for High Density Interconnector. A circuit board which has a higher wiring density per unit area as opposed to conventional board is called as HDI PCB. HDI PCBs have finer spaces and lines, minor vias and capture pads and higher connection pad density. It is helpful in enhancing electrical performance and reduction in weight and size of the equipment. HDI PCB is the better option for high-layer count and costly laminated boards.

Regarding the electrical needs of high-speed signal, the board should have various features i.e. high-frequency transmission capability, impedance control, decreases redundant radiation, etc. The board should be enhanced in the density because of the miniaturization and arrays of the electronic parts. In addition, to the result of the assembling techniques of leadless, fine pitch package and direct chip bonding, the board is even featured with exceptional high-density.

Innumerable benefits are associated with HDI PCB, like high speed, small size and high frequency. It is the primary part of portable computers, personal computers, and mobile phones. Currently, HDI PCB is extensively used in other end user products i.e. as MP3 players and game consoles, etc.

2 . Specifications:

3. Advantages:

The most common reason for using HDI technology is a significant increase in packaging density. The space obtained by finer track structures is available for components. Besides, overall space requirements are reduced will result in smaller board sizes and fewer layers.

Usually FPGA or BGA are available with 1mm or less spacing. HDI technology makes routing and connection easy, especially when routing between pins.

Our PCBs facility is located at East China, closed to Shanghai City.

We delivery our technology in High Layer Count、Rigidflex 、HDI  and other special boards with competitive cost.